a) Thermosetting Material (BMC, DMC, Bakelite, Phenolic, UP, DAP)

- Bulk/Dough Moulding Compound material.

- UP (Unsaturated Polyester Moulding Compound)

- DAP (Diallyl Phthalate Moulding Compound)

b) Engineering Plastic Compounding

- Electrostatic Discharge (ESD), Antistatic, Conductive and Special Connector material.

a) BMC / DMC injection

- Thermosetting Injection

- Compression Moulding

- Transfer Moulding